Yusuf Leblebici Presents TICA at ISSCC 2026

At a special session held in San Francisco as part of ISSCC 2026, TICA and its activities were introduced to industry professionals and academics from Silicon Valley with the participation of Prof. Dr. Yusuf Leblebici.

The Turkish Integrated Circuits Alliance (TICA) was introduced in a satellite event at the 2026 IEEE International Solid-State Circuits Conference (ISSCC 2026), which is the premier conference in the domain of microelectronics and semiconductor technologies with more than 3000 attendees annually. The meeting, organized by the Chairman of the Board of TICA, Prof. Dr. Yusuf Leblebici in San Francisco on 16 February 2026, was attended by integrated circuit designers and researchers working in companies such as Apple, Cisco, Lenovo, IBM, Microsoft, Cadence, Sandisk, Texas Instruments, Analog Devices, as well as academicians and doctoral students working in Boston University, WPI, University of California –  Berkeley, Stanford University, Purdue University, Hiroshima University, Georgia Institute of Technology, Daegu Gyeongbuk Institute of Science and Technology, EPFL, ETHZ, and KU Leuven.