TICA at Silicon Saxony Days 2026: Showcasing Türkiye’s Semiconductor Potential

On June 15, 2026, as TICA – Turkish Integrated Circuits Alliance, we took part in SiliconSaxonyDays2026 in Dresden, Germany. We were proud to be a part of one of Europe’s leading semiconductor and high-tech networking events, contributing to the future of the industry.

A Strong Voice for the Turkish IC Ecosystem

A special thank you goes to our Vice President of the Board, Ates Berna, for delivering a highly impactful presentation titled: “Turkish IC Ecosystem and Reflections on EU Economy”

The session highlighted the rapidly growing strength of Türkiye’s semiconductor ecosystem and its strategic role within the European technology landscape. During the presentation, we underlined the core pillars that make Türkiye a rising power and an ideal partner in the global semiconductor supply chain:

Top-Tier Talent Pool: Türkiye’s prestigious universities graduate world-class engineers every year. The potential of these young talents to integrate into and drive the semiconductor sector forward is higher than ever.

Highly Competitive Incentives: Türkiye offers exceptionally advantageous government incentives, R&D grants, and tax exemptions that stand out globally, making it a highly attractive hub for high-tech investments.

Global R&D Hub: Thanks to this powerful combination of elite talent and aggressive state support, numerous multinational tech giants have already established their semiconductor R&D teams in Türkiye, successfully running global operations from here.

Fostering European Collaboration: We extend our deepest gratitude to everyone who attended our session, visited us, and engaged in valuable discussions throughout the event. Within the framework of the European Chips Act, building stronger connections across Europe’s semiconductor ecosystem is essential for fostering innovation, collaboration, and sustainable growth.

Türkiye is ready to offer its robust infrastructure, strategic location, and engineering excellence to shape the future of microelectronics. We look forward to continuing these conversations and exploring new opportunities for international cooperation.

See you again next year in Dresden!